AT24C512BN-SH25-B 两线串行EEPROM芯片用户手册

AT24C512BN-SH25-B - 两线串行EEPROM

使用该芯片的有：

MYD-LPC4357 工控板/开发板

MYD-LPC4350 工控板/开发板

MYD-LPC1857 工控板/开发板

MYD-LPC1850 工控板/开发板

MYD-SAM9G15 工控板/开发板/核心板

MYD-SAM9G25 工控板/开发板/核心板

MYD-SAM9G35 工控板/开发板/核心板

MYD-SAM9X25 工控板/开发板/核心板

MYD-SAM9X35 工控板/开发板/核心板

MYS-SAM9G45 工控板/单板机

MYS-SAM9G15 工控板/单板机

MYS-SAM9G25 工控板/单板机

MYS-SAM9G35 工控板/单板机

MYS-SAM9X25 工控板/单板机

MYS-SAM9X35 工控板/单板机

Features
• Low-voltage and Standard-voltage Operation
– 1.8v (VCC = 1.8V to 3.6V)
– 2.5v (VCC = 2.5V to 5.5V)
• Internally Organized 65,536 x 8
• Two-wire Serial Interface
• Schmitt Triggers, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (2.5V, 5.5V), 400 kHz (1.8V) Compatibility
• Write Protect Pin for Hardware and Software Data Protection
• 128-byte Page Write Mode (Partial Page Writes Allowed)
• Self-timed Write Cycle (5 ms Max)
• High Reliability
– Endurance: 1,000,000 Write Cycles
– Data Retention: 40 Years
• Lead-free/Halogen-free Devices
• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, 8-ball dBGA2, and
8-lead Ultra Thin Small Array (SAP) Packages
• Die Sales: Wafer Form, Waffle Pack and Bumped Die